Product Description:
An introduction to wafer grinding
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafe
Product Description:
Joen Lih Hi-Precision CNC profile grinders are designed to meet current and future grinding requirements. The machines are engineered and manufactured to the highest industry standards starting from the raw castings right up through quality testing. This ensures optimal surface grinding accuracy and finish. Our goal is to exceed customer expectations for quality and investment.
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