| LONG Automatic Machinery Co., Ltd. |
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A. Specification:
1. Thin Carrier Plate System:
(1) Thin Carrier Plate 280(L)*180(W) m/m
(2) Thin Carrier Plate model fits for 0201. 0402. 0603. 0805~1206 chip sizes.
B. Function
Designed specifically for thin carrier plates.
Equipped with a vacuum pump to suck up thin carrier plate.
Thin carrier plate are put manually. The platform of vacuum plate is with position function.
The vacuum plate which has features of high steel rigidity and high accuracy is designed to fit 0201 or larger chips.
Remove falling down chips automatically.
Dipping unit equipped with automatic temperature controlling system (with ice cooling machine).
Supply function of paste (1) manual supply (2) automatic supply.
Security system: the door closes automatically while the machine is operating.
The up/down motion of doctor blade is controlled by servo/stepping motor for the accuracy of film thickness which is to ensure high dipping quality. Resolution of paste thickness is 0.01m/m.
The up/down-dipping unit uses servomotor with 1000(Watt) which can accelerate speed in a short time, reduce vibration, keep stabilization, and quickly response. Resolution of up/down is 0.002m/m.
The dipping paste platform uses servomotor with 400 Watt. The speed and placement parameter are set by HMI.
Stores with 32 set parameters.
Related units such as motors and pneumatic electricity are made in Japan. |
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